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Specialists of the Laser Center have developed laser systens and technologies for precision cutting of items for spectroscopy and other applications.
During manufacturing, electronic components are often combined into an array of elements placed on a single substrate or base. The density of distribution is very important. Laser technologies ensure a high density of components while reducing the distance between the elements. RX laser system provides minimal cutting width and high accuracy, and using it can significantly increase the efficiency of electronic componenets production.
RX-150 precision laser cutting system with a fiber laser source
The RX-150 precision laser cutting system is designed for high precision cutting of metals and semiconductors and works with any metals and alloys up to 4 mm thick.
More information about the system
RX-150 precision laser cutting system with a fiber laser source
The RX-150 precision laser cutting system is designed for high precision cutting of metals and semiconductors and works with any metals and alloys up to 4 mm thick.