| Saint-Petersburg | Moscow | Kazan | Phone +7 (812) 240-5060


Laser Center | Laser machines from Russia.

Processing of substrates

Laser Center combined laser cutting and engraving technologies in one laser system, which allows both creating topologies and cutting components. 

The MicroSET laser system is designed to pierce holes with high precision, create depressions, channels and mesostructures, as well as cut various components of complex shape from all major ceramic materials used in radio electronics.

Examples of application of substrate processing technology

Videos of the application of laser technology in microprocessing

Laser systems, recommended for microprocessing and the electronics industry

Other applications of laser technologies in microprocessing

The Laser Center has developed a number of technological solutions for the processing of such materials and the production of items in the electronics industry

Результаты работ

Modern trends in electronic technology require new materials and fundamentally new miniature products.

Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.

Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.

About the experience of our company in this area:

R&D and integration of laser systems

Optimization of technologies

Optimization of software

Development of designs according to specifications

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We have been producing laser equipment in St. Petersburg since 2004
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