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Processing of green and sintered ceramics

Ceramics is one of the main components is microelectronics. Specialists of the Laser Center have developed a technology for the MicroSET laser system, which allows cutting ceramics in green and sintered form.

The difficulty with processing green ceramics (LTCC and HTCC) is that if the parameters are configured incorrectly, the cutting area will glassify, thereby causing problems in the later processing stages.

When processing sintered ceramics, it is important to organize the process in such a way that the laser does not heat the ceramics to a critical state, otherwise the material will crack.

Laser systems, recommended for microprocessing and the electronics industry

Examples of ceramics processing in microelectronics

Videos of the application of laser technology in microprocessing

Other applications of laser technologies in microprocessing

Laser Center has developed a number of technological solutions for the processing of such materials and the production of items in the electronics industry

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Modern trends in electronic technology require new materials and fundamentally new miniature products.

Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.

Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.

About the experience of our company in this area:

R&D and integration of laser systems

Optimization of technologies

Optimization of software

Development of designs according to specifications

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