Ceramics is one of the main components is microelectronics. Specialists of the Laser Center have developed a technology for the MicroSET laser system, which allows cutting ceramics in green and sintered form.
The difficulty with processing green ceramics (LTCC and HTCC) is that if the parameters are configured incorrectly, the cutting area will glassify, thereby causing problems in the later processing stages.
When processing sintered ceramics, it is important to organize the process in such a way that the laser does not heat the ceramics to a critical state, otherwise the material will crack.
Laser microprocessing system
High-tech laser engraving system
High speed laser marking system
High precision laser cutting
High-precision laser cutting
Modern trends in electronic technology require new materials and fundamentally new miniature products.
Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.
Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.
About the experience of our company in this area: