Dicing is used instead of cutting to separate highly fragile materials. The essence of the process is that depressions, created in the material, become concentration points for stress, and when a small force is applied to the item's surface, the material splits along the created depression line.
High-tech laser engraving system
High speed laser marking system
High precision laser cutting
Laser microprocessing system
Modern trends in electronic technology require new materials and fundamentally new miniature products.
Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.
Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.
About the experience of our company in this area: