High-tech equipment and proven technologies of the Laser Center allow treating the surfaces of processed materials in a controlled way, so that one or more layers of coatings evaporates (is removed).
In microelectronics, controlled laser treatment makes it possible to remove the required layers without affecting the lower layers or the wafer.
High precision laser cutting
High-tech laser engraving system
High speed laser marking system
Modern trends in electronic technology require new materials and fundamentally new miniature products.
Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.
Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.
About the experience of our company in this area: