Standard technologies used in laser electronics face a number of difficulties in creating three-dimensional structures and mesostructures on semiconductors and ceramic materials.
To solve these problems, Laser Center has developed a special three-dimensional laser erosion technology.
Laser microprocessing system
High-tech laser engraving system
High precision laser cutting
High speed laser marking system
Modern trends in electronic technology require new materials and fundamentally new miniature products.
Innovative electronic products (miniature boards, resonators, and other specialized items) are produced from ceramic materials (sitall, polycor, aluminum nitride, silicon nitride, and others), as well as traditional (silicon and other semiconductors) and special (fluoroplastic, polyethylene etc.) substrates coated with various metals and alloys.
Microprocessing of such products, especially in small-scale production, requires flexible, precise and stable (repeatable) technologies because traditional (photopolymer and photochemical) methods are very expensive.
About the experience of our company in this area: